Viscoelastic properties of alkoxy silane-epoxy interpenetrating networks

R. E. Jensen; G. R. Palmese; S. H. McKnight

doi:10.1016/j.ijadhadh.2005.03.004

Viscoelastic properties of alkoxy silane-epoxy interpenetrating networks

R. E. Jensen, G. R. Palmese, S. H. McKnight

Research output: Contribution to journal › Article › peer-review

47 Scopus citations

Abstract

A model epoxy-silane interpenetrating network (IPN) was synthesized to simulate the molecular structure found at the fiber-matrix interphase. The Young's modulus (E) of the epoxy-silane IPN was determined through micromechanical analysis both quasi-statically and in the frequency domain. The epoxy-silane IPN was synthesized by diffusion of uncured diglycidyl ether of bisphenol A (DGEBA) epoxy resin and bis (p-aminocyclohexyl) methane (PACM) curing agent into spherical particles of condensed and crosslinked 3-glycidoxypropyltrimethoxysilane (GPS). This IPN composition was chosen to simulate the typical properties of a silane modified interphase found in glass reinforced composites. Differential scanning calorimetry (DSC) showed that the glass transition temperature (Tg) of the initial crosslinked siloxane network increases upon cure of the DGEBA and PACM, but was still significantly lower than that of the neat epoxy matrix. Additionally, dynamic mechanical analysis (DMA) was used in conjunction with the micromechanical C-Combining Rule to show that the Young's modulus of the epoxy-silane IPN spherical inclusions (Ei) is decreased in comparison to the Young's modulus of the matrix epoxy (Em) at all temperatures. The time-temperature superposition (tTsp) principle was successfully applied to the epoxy-silane IPN to determine viscoelastic properties at high frequencies. The viscoelastic properties of the epoxy-silane IPN may have implications with respect to the ballistic impact resistance of composite structures used for Army applications. Published by Elsevier Ltd.

Original language	English (US)
Pages (from-to)	103-115
Number of pages	13
Journal	International Journal of Adhesion and Adhesives
Volume	26
Issue number	1-2
DOIs	https://doi.org/10.1016/j.ijadhadh.2005.03.004
State	Published - Feb 2006
Externally published	Yes

All Science Journal Classification (ASJC) codes

Biomaterials
General Chemical Engineering
Polymers and Plastics

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10.1016/j.ijadhadh.2005.03.004

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@article{4cd4e06a118a43bf859d9cec00ce936a,

title = "Viscoelastic properties of alkoxy silane-epoxy interpenetrating networks",

abstract = "A model epoxy-silane interpenetrating network (IPN) was synthesized to simulate the molecular structure found at the fiber-matrix interphase. The Young's modulus (E) of the epoxy-silane IPN was determined through micromechanical analysis both quasi-statically and in the frequency domain. The epoxy-silane IPN was synthesized by diffusion of uncured diglycidyl ether of bisphenol A (DGEBA) epoxy resin and bis (p-aminocyclohexyl) methane (PACM) curing agent into spherical particles of condensed and crosslinked 3-glycidoxypropyltrimethoxysilane (GPS). This IPN composition was chosen to simulate the typical properties of a silane modified interphase found in glass reinforced composites. Differential scanning calorimetry (DSC) showed that the glass transition temperature (Tg) of the initial crosslinked siloxane network increases upon cure of the DGEBA and PACM, but was still significantly lower than that of the neat epoxy matrix. Additionally, dynamic mechanical analysis (DMA) was used in conjunction with the micromechanical C-Combining Rule to show that the Young's modulus of the epoxy-silane IPN spherical inclusions (Ei) is decreased in comparison to the Young's modulus of the matrix epoxy (Em) at all temperatures. The time-temperature superposition (tTsp) principle was successfully applied to the epoxy-silane IPN to determine viscoelastic properties at high frequencies. The viscoelastic properties of the epoxy-silane IPN may have implications with respect to the ballistic impact resistance of composite structures used for Army applications. Published by Elsevier Ltd.",

author = "Jensen, {R. E.} and Palmese, {G. R.} and McKnight, {S. H.}",

note = "Funding Information: This research was supported in part by an appointment to the Research Participation Program at the US Army Research Laboratory administered by the Oak Ridge Institute for Science and Education through an interagency agreement between the US Department of Energy and USARL. The authors also wish to thank the ARL Composite Materials Research (CMR) Materials Center of Excellence contract DAAL01-96-2-0048 to the University of Delaware Center for Composite Materials (UD-CCM) for partial funding of this project. The authors would also like to thank Owens Corning Fiberglass for supply of the epoxy film former emulsion used in the model silane formulation. The authors also wish to acknowledge the technical assistance provided by John Mullin, Gene Napadensky, and Phil Patterson at ARL. The authors are also very grateful for the assistance of the late Professor Roy L. McCullough at UD-CCM. He was a kind spirit and will be sincerely missed. Appendix ",

year = "2006",

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doi = "10.1016/j.ijadhadh.2005.03.004",

language = "English (US)",

volume = "26",

pages = "103--115",

journal = "International Journal of Adhesion and Adhesives",

issn = "0143-7496",

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T1 - Viscoelastic properties of alkoxy silane-epoxy interpenetrating networks

AU - Jensen, R. E.

AU - Palmese, G. R.

AU - McKnight, S. H.

N1 - Funding Information: This research was supported in part by an appointment to the Research Participation Program at the US Army Research Laboratory administered by the Oak Ridge Institute for Science and Education through an interagency agreement between the US Department of Energy and USARL. The authors also wish to thank the ARL Composite Materials Research (CMR) Materials Center of Excellence contract DAAL01-96-2-0048 to the University of Delaware Center for Composite Materials (UD-CCM) for partial funding of this project. The authors would also like to thank Owens Corning Fiberglass for supply of the epoxy film former emulsion used in the model silane formulation. The authors also wish to acknowledge the technical assistance provided by John Mullin, Gene Napadensky, and Phil Patterson at ARL. The authors are also very grateful for the assistance of the late Professor Roy L. McCullough at UD-CCM. He was a kind spirit and will be sincerely missed. Appendix

PY - 2006/2

Y1 - 2006/2

N2 - A model epoxy-silane interpenetrating network (IPN) was synthesized to simulate the molecular structure found at the fiber-matrix interphase. The Young's modulus (E) of the epoxy-silane IPN was determined through micromechanical analysis both quasi-statically and in the frequency domain. The epoxy-silane IPN was synthesized by diffusion of uncured diglycidyl ether of bisphenol A (DGEBA) epoxy resin and bis (p-aminocyclohexyl) methane (PACM) curing agent into spherical particles of condensed and crosslinked 3-glycidoxypropyltrimethoxysilane (GPS). This IPN composition was chosen to simulate the typical properties of a silane modified interphase found in glass reinforced composites. Differential scanning calorimetry (DSC) showed that the glass transition temperature (Tg) of the initial crosslinked siloxane network increases upon cure of the DGEBA and PACM, but was still significantly lower than that of the neat epoxy matrix. Additionally, dynamic mechanical analysis (DMA) was used in conjunction with the micromechanical C-Combining Rule to show that the Young's modulus of the epoxy-silane IPN spherical inclusions (Ei) is decreased in comparison to the Young's modulus of the matrix epoxy (Em) at all temperatures. The time-temperature superposition (tTsp) principle was successfully applied to the epoxy-silane IPN to determine viscoelastic properties at high frequencies. The viscoelastic properties of the epoxy-silane IPN may have implications with respect to the ballistic impact resistance of composite structures used for Army applications. Published by Elsevier Ltd.

AB - A model epoxy-silane interpenetrating network (IPN) was synthesized to simulate the molecular structure found at the fiber-matrix interphase. The Young's modulus (E) of the epoxy-silane IPN was determined through micromechanical analysis both quasi-statically and in the frequency domain. The epoxy-silane IPN was synthesized by diffusion of uncured diglycidyl ether of bisphenol A (DGEBA) epoxy resin and bis (p-aminocyclohexyl) methane (PACM) curing agent into spherical particles of condensed and crosslinked 3-glycidoxypropyltrimethoxysilane (GPS). This IPN composition was chosen to simulate the typical properties of a silane modified interphase found in glass reinforced composites. Differential scanning calorimetry (DSC) showed that the glass transition temperature (Tg) of the initial crosslinked siloxane network increases upon cure of the DGEBA and PACM, but was still significantly lower than that of the neat epoxy matrix. Additionally, dynamic mechanical analysis (DMA) was used in conjunction with the micromechanical C-Combining Rule to show that the Young's modulus of the epoxy-silane IPN spherical inclusions (Ei) is decreased in comparison to the Young's modulus of the matrix epoxy (Em) at all temperatures. The time-temperature superposition (tTsp) principle was successfully applied to the epoxy-silane IPN to determine viscoelastic properties at high frequencies. The viscoelastic properties of the epoxy-silane IPN may have implications with respect to the ballistic impact resistance of composite structures used for Army applications. Published by Elsevier Ltd.

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ER -

Viscoelastic properties of alkoxy silane-epoxy interpenetrating networks

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