Vertical integration of system-on-chip concepts in the digital design curriculum

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The rapid evolution of System-on-Chip (SoC) challenges academic curricula to keep pace with multidisciplinary/interdisciplinary system thinking. This paper presents a curricular prototype that cuts across artificial course boundaries and provides a meaningful exploration of diverse facets of SoC design. Specifically, experimental contents of a digital flow SoC product design-a simplified Transmission Control Protocol (TCP)/Internet Protocol (IP) stack-are systematically developed and implemented in the series of courses that comprise the Digital Design track of the Rowan Electrical and Computer Engineering (ECE) curriculum. The System-on-Chip project and its progressively more complex laboratory modules are described and discussed. Its implementation in the existing ECE curriculum is also presented along with the assessment results.

Original languageEnglish (US)
Article number5477209
Pages (from-to)188-196
Number of pages9
JournalIEEE Transactions on Education
Volume54
Issue number2
DOIs
StatePublished - May 1 2011

Fingerprint

Curricula
curriculum
Transmission control protocol
Internet protocols
engineering
Product design
product design
System-on-chip
Internet

All Science Journal Classification (ASJC) codes

  • Education
  • Electrical and Electronic Engineering

Cite this

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Vertical integration of system-on-chip concepts in the digital design curriculum. / Tang, Ying; Head, Linda M.; Ramachandran, Ravi P.; Chatman, Lawrence M.

In: IEEE Transactions on Education, Vol. 54, No. 2, 5477209, 01.05.2011, p. 188-196.

Research output: Contribution to journalArticle

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