Vertical integration of system-on-chip concepts in the digital design curriculum

Ying Tang; Linda M. Head; Ravi P. Ramachandran; Lawrence M. Chatman

doi:10.1109/MSE.2009.5270824

Vertical integration of system-on-chip concepts in the digital design curriculum

Ying Tang, Linda M. Head, Ravi P. Ramachandran, Lawrence M. Chatman

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

The rapid evolution of System-on-Chip (SoC) challenges academic curricula to keep pace in instilling multidisciplinary/interdisciplinary system thinking. This paper presents such a curricular prototype that cuts across artificial course boundaries and provides a meaningful exploration of diverse facets of SoC design. More specifically, a series of experimental contents towards a digital flow SoC product design - a simplified transmission control protocol (TCP) stack are systematically developed and implemented at all levels of the Rowan Electrical and Computer Engineering (ECE) curriculum. The detailed project and its laboratory modules of progressive complexity are discussed. Its implementation in the existing ECE curriculum is also presented.

Original language	English (US)
Title of host publication	2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009
Pages	85-88
Number of pages	4
DOIs	https://doi.org/10.1109/MSE.2009.5270824
State	Published - 2009
Event	2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009 - San Francisco, CA, United States Duration: Jul 25 2009 → Jul 27 2009

Publication series

Name	2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009

Other

Other	2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009
Country/Territory	United States
City	San Francisco, CA
Period	7/25/09 → 7/27/09

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Education

Access to Document

10.1109/MSE.2009.5270824

Cite this

Tang, Y., Head, L. M., Ramachandran, R. P., & Chatman, L. M. (2009). Vertical integration of system-on-chip concepts in the digital design curriculum. In 2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009 (pp. 85-88). Article 5270824 (2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009). https://doi.org/10.1109/MSE.2009.5270824

@inproceedings{918c24a87456467c8dc450686b88e11c,

title = "Vertical integration of system-on-chip concepts in the digital design curriculum",

abstract = "The rapid evolution of System-on-Chip (SoC) challenges academic curricula to keep pace in instilling multidisciplinary/interdisciplinary system thinking. This paper presents such a curricular prototype that cuts across artificial course boundaries and provides a meaningful exploration of diverse facets of SoC design. More specifically, a series of experimental contents towards a digital flow SoC product design - a simplified transmission control protocol (TCP) stack are systematically developed and implemented at all levels of the Rowan Electrical and Computer Engineering (ECE) curriculum. The detailed project and its laboratory modules of progressive complexity are discussed. Its implementation in the existing ECE curriculum is also presented.",

author = "Ying Tang and Head, {Linda M.} and Ramachandran, {Ravi P.} and Chatman, {Lawrence M.}",

year = "2009",

doi = "10.1109/MSE.2009.5270824",

language = "English (US)",

isbn = "9781424444069",

series = "2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009",

pages = "85--88",

booktitle = "2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009",

note = "2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009 ; Conference date: 25-07-2009 Through 27-07-2009",

}

Tang, Y, Head, LM, Ramachandran, RP & Chatman, LM 2009, Vertical integration of system-on-chip concepts in the digital design curriculum. in 2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009., 5270824, 2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009, pp. 85-88, 2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009, San Francisco, CA, United States, 7/25/09. https://doi.org/10.1109/MSE.2009.5270824

Vertical integration of system-on-chip concepts in the digital design curriculum. / Tang, Ying; Head, Linda M.; Ramachandran, Ravi P. et al.
2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009. 2009. p. 85-88 5270824 (2009 IEEE International Conference on Microelectronic Systems Education, MSE 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - The rapid evolution of System-on-Chip (SoC) challenges academic curricula to keep pace in instilling multidisciplinary/interdisciplinary system thinking. This paper presents such a curricular prototype that cuts across artificial course boundaries and provides a meaningful exploration of diverse facets of SoC design. More specifically, a series of experimental contents towards a digital flow SoC product design - a simplified transmission control protocol (TCP) stack are systematically developed and implemented at all levels of the Rowan Electrical and Computer Engineering (ECE) curriculum. The detailed project and its laboratory modules of progressive complexity are discussed. Its implementation in the existing ECE curriculum is also presented.

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Vertical integration of system-on-chip concepts in the digital design curriculum

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All Science Journal Classification (ASJC) codes

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