The statistical distribution of 1/f2 noise in thin metal films under accelerated electromigration test conditions

Linda Head, Bao Le, Charles T.M. Chen, Joseph Swiatkowski

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

The levels of excess current noise in metal thin films under accelerated stress conditions have been shown to correlate well with traditional electromigration lifetimes determined from median time to failure (MTF) tests. The goals of this study were to obtain the magnitudes of a series of noise measurements taken on a metal-thin-film stripe or a set of metal-thin-film stripes where the activation energies for the noise generation processes could be assumed to be normally distributed. The values obtained from the noise measurements were determined, and the statistical distribution of the reciprocals of these values was examined. In particular, an attempt was made to determine the goodness of fit between the 1/f2 noise measurement data and the theoretical lognormal distribution. It is shown that the reciprocal of the 1/f2 noise magnitudes, taken at a single frequency, for a large group of identical films can also be modeled by the lognormal distribution.

Original languageEnglish (US)
Title of host publicationAnnual Proceedings - Reliability Physics (Symposium)
PublisherPubl by IEEE
Pages228-231
Number of pages4
ISBN (Print)078030473X
StatePublished - Mar 1 1992
Externally publishedYes
EventProceedings of the 30th Annual International Reliability Physics Symposium - San Diego, CA, USA
Duration: Mar 31 1992Apr 2 1992

Other

OtherProceedings of the 30th Annual International Reliability Physics Symposium
CitySan Diego, CA, USA
Period3/31/924/2/92

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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