TY - JOUR
T1 - Temperature-Dependent Dielectric Properties of Polyimide (PI) and Polyamide (PA) Nanocomposites
AU - Cook, Jordan
AU - Hones, Harrison
AU - Mahon, Jacob
AU - Yu, Lei
AU - Krchnavek, Robert
AU - Xue, Wei
N1 - Funding Information:
Manuscript received May 31, 2021; accepted July 13, 2021. Date of publication July 20, 2021; date of current version August 11, 2021. This work was supported in part by the Department of Defense under the Naval Surface Warfare Center (NSWC) and the Naval Engineering Education Consortium (NEEC) under Grant NSWC IHEODTD N00174-17-1-0008 and in part by the National Science Foundation under Grant CBET #1625816. The review of this paper was arranged by Associate Editor Sorin Cotofana. (Corresponding author: Wei Xue).
Publisher Copyright:
© 2002-2012 IEEE.
PY - 2021
Y1 - 2021
N2 - Cryogenic dielectrics are a crucial component for applied superconducting systems such as high-temperature superconductor (HTS) cables. Here two types of polymer nanocomposites were investigated as dielectrics for cryogenic applications. Both polyimide (PI) and polyamide (PA) nanocomposites showed exceptional performance as dielectrics, with PI as the stronger material. Significant dielectric strength improvement was observed for samples tested in the cryogenic environment when compared to those tested at the room temperature. The PI exhibited a high dielectric strength of 347 ± 67 kV/mm at 92 K, while its nanocomposites were in the range of 261-280 kV/mm. The performance change of these dielectrics was influenced by a number of factors including the density of free charge carriers, localized heat generation and material degradation, thermal contraction of polymers, and polymer-nanoparticle interfacial changes at cryogenic temperatures. The findings from this research can help advance the understanding of breakdown failures in cryogenic dielectrics.
AB - Cryogenic dielectrics are a crucial component for applied superconducting systems such as high-temperature superconductor (HTS) cables. Here two types of polymer nanocomposites were investigated as dielectrics for cryogenic applications. Both polyimide (PI) and polyamide (PA) nanocomposites showed exceptional performance as dielectrics, with PI as the stronger material. Significant dielectric strength improvement was observed for samples tested in the cryogenic environment when compared to those tested at the room temperature. The PI exhibited a high dielectric strength of 347 ± 67 kV/mm at 92 K, while its nanocomposites were in the range of 261-280 kV/mm. The performance change of these dielectrics was influenced by a number of factors including the density of free charge carriers, localized heat generation and material degradation, thermal contraction of polymers, and polymer-nanoparticle interfacial changes at cryogenic temperatures. The findings from this research can help advance the understanding of breakdown failures in cryogenic dielectrics.
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U2 - 10.1109/TNANO.2021.3098233
DO - 10.1109/TNANO.2021.3098233
M3 - Article
AN - SCOPUS:85111065139
SN - 1536-125X
VL - 20
SP - 584
EP - 591
JO - IEEE Transactions on Nanotechnology
JF - IEEE Transactions on Nanotechnology
M1 - 9492003
ER -