SEDS: Expanding TEDS to include physical structures

Brian Dixon; George Lecakes; Paul K. Moon; John Schmalzel

doi:10.1109/SAS.2018.8336783

SEDS: Expanding TEDS to include physical structures

Brian Dixon, George Lecakes, Paul K. Moon, John Schmalzel

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Due to the increasingly complex nature of systems, there are benefits in expanding the IEEE 1451.x Transducer Electronics Data Sheet (TEDS) standards to include the physical structures included in these systems. In this paper, we present a format and methodology for Structural Electronics Data Sheets (SEDS) to accurately describe sensor housings, generic enclosures, test chassis, and instrumentation fixtures. SEDS provides the additional functionality to complement systems, such as automatic calibration and compensation of environmental factors that influence the system's physical aspects. We propose the standard's starting point for both SEDS contained on memory as well as a virtual SEDS, accessible from a source external to the structure.

Original language	English (US)
Title of host publication	2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-6
Number of pages	6
ISBN (Electronic)	9781538620922
DOIs	https://doi.org/10.1109/SAS.2018.8336783
State	Published - Apr 11 2018
Event	2018 IEEE Sensors Applications Symposium, SAS 2018 - Seoul, Korea, Republic of Duration: Mar 12 2018 → Mar 14 2018

Publication series

Name	2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings
Volume	2018-January

Other

Other	2018 IEEE Sensors Applications Symposium, SAS 2018
Country/Territory	Korea, Republic of
City	Seoul
Period	3/12/18 → 3/14/18

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Instrumentation

Access to Document

10.1109/SAS.2018.8336783

Cite this

Dixon, B., Lecakes, G., Moon, P. K., & Schmalzel, J. (2018). SEDS: Expanding TEDS to include physical structures. In 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings (pp. 1-6). (2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SAS.2018.8336783

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title = "SEDS: Expanding TEDS to include physical structures",

abstract = "Due to the increasingly complex nature of systems, there are benefits in expanding the IEEE 1451.x Transducer Electronics Data Sheet (TEDS) standards to include the physical structures included in these systems. In this paper, we present a format and methodology for Structural Electronics Data Sheets (SEDS) to accurately describe sensor housings, generic enclosures, test chassis, and instrumentation fixtures. SEDS provides the additional functionality to complement systems, such as automatic calibration and compensation of environmental factors that influence the system's physical aspects. We propose the standard's starting point for both SEDS contained on memory as well as a virtual SEDS, accessible from a source external to the structure.",

author = "Brian Dixon and George Lecakes and Moon, {Paul K.} and John Schmalzel",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 2018 IEEE Sensors Applications Symposium, SAS 2018 ; Conference date: 12-03-2018 Through 14-03-2018",

year = "2018",

month = apr,

day = "11",

doi = "10.1109/SAS.2018.8336783",

language = "English (US)",

series = "2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1--6",

booktitle = "2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings",

address = "United States",

}

Dixon, B, Lecakes, G, Moon, PK & Schmalzel, J 2018, SEDS: Expanding TEDS to include physical structures. in 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings. 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-6, 2018 IEEE Sensors Applications Symposium, SAS 2018, Seoul, Korea, Republic of, 3/12/18. https://doi.org/10.1109/SAS.2018.8336783

SEDS: Expanding TEDS to include physical structures. / Dixon, Brian; Lecakes, George; Moon, Paul K. et al.
2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-6 (2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - SEDS

T2 - 2018 IEEE Sensors Applications Symposium, SAS 2018

AU - Dixon, Brian

AU - Lecakes, George

AU - Moon, Paul K.

AU - Schmalzel, John

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Y1 - 2018/4/11

N2 - Due to the increasingly complex nature of systems, there are benefits in expanding the IEEE 1451.x Transducer Electronics Data Sheet (TEDS) standards to include the physical structures included in these systems. In this paper, we present a format and methodology for Structural Electronics Data Sheets (SEDS) to accurately describe sensor housings, generic enclosures, test chassis, and instrumentation fixtures. SEDS provides the additional functionality to complement systems, such as automatic calibration and compensation of environmental factors that influence the system's physical aspects. We propose the standard's starting point for both SEDS contained on memory as well as a virtual SEDS, accessible from a source external to the structure.

AB - Due to the increasingly complex nature of systems, there are benefits in expanding the IEEE 1451.x Transducer Electronics Data Sheet (TEDS) standards to include the physical structures included in these systems. In this paper, we present a format and methodology for Structural Electronics Data Sheets (SEDS) to accurately describe sensor housings, generic enclosures, test chassis, and instrumentation fixtures. SEDS provides the additional functionality to complement systems, such as automatic calibration and compensation of environmental factors that influence the system's physical aspects. We propose the standard's starting point for both SEDS contained on memory as well as a virtual SEDS, accessible from a source external to the structure.

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M3 - Conference contribution

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BT - 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 12 March 2018 through 14 March 2018

ER -

SEDS: Expanding TEDS to include physical structures

Abstract

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All Science Journal Classification (ASJC) codes

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