SEDS: Expanding TEDS to include physical structures

Brian Dixon, George Lecakes, Paul K. Moon, John Schmalzel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the increasingly complex nature of systems, there are benefits in expanding the IEEE 1451.x Transducer Electronics Data Sheet (TEDS) standards to include the physical structures included in these systems. In this paper, we present a format and methodology for Structural Electronics Data Sheets (SEDS) to accurately describe sensor housings, generic enclosures, test chassis, and instrumentation fixtures. SEDS provides the additional functionality to complement systems, such as automatic calibration and compensation of environmental factors that influence the system's physical aspects. We propose the standard's starting point for both SEDS contained on memory as well as a virtual SEDS, accessible from a source external to the structure.

Original languageEnglish (US)
Title of host publication2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
ISBN (Electronic)9781538620922
DOIs
StatePublished - Apr 11 2018
Event2018 IEEE Sensors Applications Symposium, SAS 2018 - Seoul, Korea, Republic of
Duration: Mar 12 2018Mar 14 2018

Publication series

Name2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings
Volume2018-January

Other

Other2018 IEEE Sensors Applications Symposium, SAS 2018
CountryKorea, Republic of
CitySeoul
Period3/12/183/14/18

Fingerprint

electronic transducers
Transducers
Electronic equipment
electronics
chassis
fixtures
Chassis
enclosure
Enclosures
complement
format
Calibration
methodology
Data storage equipment
sensors
Sensors

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Instrumentation

Cite this

Dixon, B., Lecakes, G., Moon, P. K., & Schmalzel, J. (2018). SEDS: Expanding TEDS to include physical structures. In 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings (pp. 1-6). (2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SAS.2018.8336783
Dixon, Brian ; Lecakes, George ; Moon, Paul K. ; Schmalzel, John. / SEDS : Expanding TEDS to include physical structures. 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-6 (2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings).
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Dixon, B, Lecakes, G, Moon, PK & Schmalzel, J 2018, SEDS: Expanding TEDS to include physical structures. in 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings. 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-6, 2018 IEEE Sensors Applications Symposium, SAS 2018, Seoul, Korea, Republic of, 3/12/18. https://doi.org/10.1109/SAS.2018.8336783

SEDS : Expanding TEDS to include physical structures. / Dixon, Brian; Lecakes, George; Moon, Paul K.; Schmalzel, John.

2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-6 (2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Dixon B, Lecakes G, Moon PK, Schmalzel J. SEDS: Expanding TEDS to include physical structures. In 2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-6. (2018 IEEE Sensors Applications Symposium, SAS 2018 - Proceedings). https://doi.org/10.1109/SAS.2018.8336783