Resistance transients in thin-film noise data

Linda Head

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations


Noise measurements taken at accelerated stressing conditions do not work for the prediction of VLSI interconnect lifetime. This is because a crucial feature of the resistance changes under accelerated bias, which could provide insight into metallization reliability, is obscured by spectral analysis. Distinctive resistance transients occur sporadically during accelerated life testing and it is the presence of these transients that make Fourier analysis inappropriate. Recent work has shown that abrupt changes of resistance (ACRs) in a dc biased thin metal film can be correlated with voiding processes. It is the sensitivity of a measurement system designed to detect very low level noise fluctuations that allows one to detect these small resistance. The analysis of this data from a time-domain perspective has great potential for advancing the understanding of damage processes in metallization. This presentation will provide details of the detection of resistance transients, evidence of their correlation to voiding processes, and data from a detection system designed to monitor the transients.

Original languageEnglish (US)
Number of pages6
StatePublished - Dec 1 1997
EventProceedings of the 1997 IEEE International Integrated Reliability Workshop - Tahoe, CA, USA
Duration: Oct 13 1997Oct 16 1997


OtherProceedings of the 1997 IEEE International Integrated Reliability Workshop
CityTahoe, CA, USA

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering


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