Relaxed-Tolerance Optoelectronic Device Packaging

Leslie A. Reith; James W. Mann; Gail R. Lalk; Robert R. Krchnavek; Nicholas C. Andreadakis; Chung en Zah

doi:10.1109/50.76662

Relaxed-Tolerance Optoelectronic Device Packaging

Leslie A. Reith
, James W. Mann
, Gail R. Lalk
, Robert R. Krchnavek
, Nicholas C. Andreadakis
, Chung en Zah

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

Highly efficient, reliable packaging of semiconductor optical devices such as lasers and optical amplifiers remains an expensive and challenging task. In this paper, we present an approach to single-mode fiber coupling which results in relaxed alignment tolerances during the package assembly process, while maintaining coupling efficiencies as high as 34-40%. In addition, the approach provides some versatility with respect to the placement of passive optical components inside the package.

Original language	English (US)
Pages (from-to)	477-484
Number of pages	8
Journal	Journal of Lightwave Technology
Volume	9
Issue number	4
DOIs	https://doi.org/10.1109/50.76662
State	Published - Apr 1991
Externally published	Yes

All Science Journal Classification (ASJC) codes

Atomic and Molecular Physics, and Optics

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10.1109/50.76662

Cite this

@article{8e0b01dd4d3547cd860909542bd172d9,

title = "Relaxed-Tolerance Optoelectronic Device Packaging",

abstract = "Highly efficient, reliable packaging of semiconductor optical devices such as lasers and optical amplifiers remains an expensive and challenging task. In this paper, we present an approach to single-mode fiber coupling which results in relaxed alignment tolerances during the package assembly process, while maintaining coupling efficiencies as high as 34-40\%. In addition, the approach provides some versatility with respect to the placement of passive optical components inside the package.",

author = "Reith, \{Leslie A.\} and Mann, \{James W.\} and Lalk, \{Gail R.\} and Krchnavek, \{Robert R.\} and Andreadakis, \{Nicholas C.\} and Zah, \{Chung en\}",

year = "1991",

month = apr,

doi = "10.1109/50.76662",

language = "English (US)",

volume = "9",

pages = "477--484",

journal = "Journal of Lightwave Technology",

issn = "0733-8724",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Relaxed-Tolerance Optoelectronic Device Packaging

AU - Reith, Leslie A.

AU - Mann, James W.

AU - Lalk, Gail R.

AU - Krchnavek, Robert R.

AU - Andreadakis, Nicholas C.

AU - Zah, Chung en

PY - 1991/4

Y1 - 1991/4

N2 - Highly efficient, reliable packaging of semiconductor optical devices such as lasers and optical amplifiers remains an expensive and challenging task. In this paper, we present an approach to single-mode fiber coupling which results in relaxed alignment tolerances during the package assembly process, while maintaining coupling efficiencies as high as 34-40%. In addition, the approach provides some versatility with respect to the placement of passive optical components inside the package.

AB - Highly efficient, reliable packaging of semiconductor optical devices such as lasers and optical amplifiers remains an expensive and challenging task. In this paper, we present an approach to single-mode fiber coupling which results in relaxed alignment tolerances during the package assembly process, while maintaining coupling efficiencies as high as 34-40%. In addition, the approach provides some versatility with respect to the placement of passive optical components inside the package.

UR - https://www.scopus.com/pages/publications/0026136647

UR - https://www.scopus.com/pages/publications/0026136647#tab=citedBy

U2 - 10.1109/50.76662

DO - 10.1109/50.76662

M3 - Article

AN - SCOPUS:0026136647

SN - 0733-8724

VL - 9

SP - 477

EP - 484

JO - Journal of Lightwave Technology

JF - Journal of Lightwave Technology

IS - 4

ER -

Relaxed-Tolerance Optoelectronic Device Packaging

Abstract

All Science Journal Classification (ASJC) codes

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