Relaxed-Tolerance Optoelectronic Device Packaging

Leslie A. Reith; James W. Mann; Gail R. Lalk; Robert R. Krchnavek; Nicholas C. Andreadakis; Chung en Zah

doi:10.1109/50.76662

Relaxed-Tolerance Optoelectronic Device Packaging

Leslie A. Reith, James W. Mann, Gail R. Lalk, Robert R. Krchnavek, Nicholas C. Andreadakis, Chung en Zah

Electrical Engineering

Research output: Contribution to journal › Article

25 Scopus citations

Abstract

Highly efficient, reliable packaging of semiconductor optical devices such as lasers and optical amplifiers remains an expensive and challenging task. In this paper, we present an approach to single-mode fiber coupling which results in relaxed alignment tolerances during the package assembly process, while maintaining coupling efficiencies as high as 34-40%. In addition, the approach provides some versatility with respect to the placement of passive optical components inside the package.

Original language	English (US)
Pages (from-to)	477-484
Number of pages	8
Journal	Journal of Lightwave Technology
Volume	9
Issue number	4
DOIs	https://doi.org/10.1109/50.76662
State	Published - Apr 1991

All Science Journal Classification (ASJC) codes

Atomic and Molecular Physics, and Optics

Access to Document

10.1109/50.76662

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Reith, L. A., Mann, J. W., Lalk, G. R., Krchnavek, R. R., Andreadakis, N. C., & Zah, C. E. (1991). Relaxed-Tolerance Optoelectronic Device Packaging. Journal of Lightwave Technology, 9(4), 477-484. https://doi.org/10.1109/50.76662

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