Relaxed-Tolerance Optoelectronic Device Packaging

Leslie A. Reith, James W. Mann, Gail R. Lalk, Robert R. Krchnavek, Nicholas C. Andreadakis, Chung en Zah

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

Highly efficient, reliable packaging of semiconductor optical devices such as lasers and optical amplifiers remains an expensive and challenging task. In this paper, we present an approach to single-mode fiber coupling which results in relaxed alignment tolerances during the package assembly process, while maintaining coupling efficiencies as high as 34-40%. In addition, the approach provides some versatility with respect to the placement of passive optical components inside the package.

Original languageEnglish (US)
Pages (from-to)477-484
Number of pages8
JournalJournal of Lightwave Technology
Volume9
Issue number4
DOIs
StatePublished - Apr 1991
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics

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