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Processing/structure/property relationships of E-beam cured cationic epoxy
D. P. Anderson
, D. A. Klosterman
,
G. R. Palmese
, J. Lee
, A. Johnston
, A. J. Colleary
, A. Desai
, C. W. Lee
, J. M. Brown
Research output
:
Contribution to journal
›
Conference article
›
peer-review
Overview
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Keyphrases
Network Structure
100%
Epoxy
100%
Electron Beam
100%
Process-structure-property Relationship
100%
Toughness
50%
Water Content
50%
Mechanical Properties
50%
Swelling Studies
50%
Tensile Strength
50%
Dynamic Mechanical Analysis
50%
Tensile Modulus
50%
Flex
50%
Residual Heat
50%
Curing Properties
50%
Epoxy Resin Systems
50%
Degree of Cure
50%
Epoxy Networks
50%
Heat of Reaction
50%
Material Science
Young's Modulus
100%
Ultimate Tensile Strength
100%
Mechanical Strength
100%
Differential Scanning Calorimetry
100%
Dynamic Mechanical Analysis
100%
Heat of Reaction
100%
Engineering
Property Relationship
100%
Cationic Epoxy
100%
Young's Modulus
50%
Ultimate Tensile Strength
50%
Dynamic Mechanical Analysis
50%