Abstract
An investigation of potential physical design bottlenecks in future broadband telecommunication switches has led to the identification of several areas where optical interconnections may play a role in the practical realization of required system performance. In the model used, the speed and interconnection densities as well as requirements for ease-of-access and efficient power utilization challenge conventional partitioning and packaging strategies. Potential areas where optical interconnections may relieve some of the physical design bottlenecks include fiber management at the customer interface to the switch, routing and distribution of high-density interconnections within the fabric of the switch, and backplane interconnections to increase system throughput.
Original language | English (US) |
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Pages (from-to) | 386-400 |
Number of pages | 15 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 1389 |
DOIs | |
State | Published - Apr 1 1991 |
Externally published | Yes |
Event | Microelectronic Interconnects and Packages: Optical and Electrical Technologies 1990 - Boston, United States Duration: Nov 4 1990 → Nov 9 1990 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering