PMMA Nanocomposite Based Cryogenic Dielectrics for High-Temperature Superconducting (HTS) Cables

Jordan Cook, Jacob Mahon, William Emmerling, Lei Yu, Robert R. Krchnavek, Wei Xue

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High-temperature superconducting (HTS) cable systems delaminate at 175°C, necessitating a low processing temperature dielectric coating. A polymer nanocomposite can be prepared at temperatures below the HTS cable delamination temperature, mitigating this issue. The proposed polymer nanocomposite was composed of polymethyl methacrylate (PMMA) and impregnated with silicon dioxide (SiO2) to improve the dielectric performance of the base polymer. Dielectric breakdown testing shows a significant increase in the dielectric strength of PMMA/SiO2 composites at cryogenic temperatures when compared to room temperature testing. The increase is most significant across higher filler concentrations where the dielectric strength more than triples over room temperature values from 60-90 kV/mm to 290 kV/mm. The impact a colder testing environment has on dielectric performance makes PMMA/SiO2 nanocomposites a promising low temperature processing dielectric for adoption into HTS cable systems.

Original languageEnglish (US)
Title of host publication2021 IEEE 16th Nanotechnology Materials and Devices Conference, NMDC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665418928
DOIs
StatePublished - 2021
Event16th IEEE Nanotechnology Materials and Devices Conference, NMDC 2021 - Vancouver, Canada
Duration: Dec 12 2021Dec 15 2021

Publication series

Name2021 IEEE 16th Nanotechnology Materials and Devices Conference, NMDC 2021

Conference

Conference16th IEEE Nanotechnology Materials and Devices Conference, NMDC 2021
Country/TerritoryCanada
CityVancouver
Period12/12/2112/15/21

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Instrumentation
  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

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