Oven for component thermal characterization

Philip K. Wong, John L. Schmalzel

Research output: Contribution to conferencePaper

Abstract

A simple, low-cost oven suitable for characterization of small components over the commercial temperature range (0-70°C) is described. The oven has been applied to the thermal characterization of light-emitting diodes used in an instrument design. The prototype oven system hardware includes a PC-instrument digital multimeter, an interface with power supplies, a heated plate, and a small refrigerator. Oven control, data acquisition, and data analysis are all performed using the software package ASYST.

Original languageEnglish (US)
Number of pages1
Publication statusPublished - Dec 1 1988
EventProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society - New Orleans, LA, USA
Duration: Nov 4 1988Nov 7 1988

Other

OtherProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society
CityNew Orleans, LA, USA
Period11/4/8811/7/88

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All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Wong, P. K., & Schmalzel, J. L. (1988). Oven for component thermal characterization. Paper presented at Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, New Orleans, LA, USA, .