New SWEAT method for fast, accurate and stable electromigration testing on wafer level

Jochen von Hagen, Georg Antonin, Josef Fazekas, Linda Head, Harry Schafft

Research output: Contribution to conferencePaperpeer-review

11 Scopus citations

Abstract

The Standard Wafer Level Electromigration Accelerated Test (SWEAT) is one of a few highly accelerated stress tests of metal-line test structures that are used to monitor electromigration resistance. Earlier works and our own examinations have shown that when the JEDEC standard SWEAT method is used, unexpectedly large sigmas are observed that could sometimes be traced to the existence of bimodal failure-time distributions. We show that the cause for these anomalous behaviors is the algorithm in the JEDEC standard method that is used in the control loop to adjust the stress current so that a constant target failure time is maintained. A new algorithm is described and experimental results are given to demonstrate its effectiveness.

Original languageEnglish (US)
Pages85-89
Number of pages5
StatePublished - Dec 1 2000
Externally publishedYes
Event2000 IEEE International Integrated Reliability Workshop - Lake Tahoe, CA, USA
Duration: Oct 23 2000Oct 26 2000

Other

Other2000 IEEE International Integrated Reliability Workshop
CityLake Tahoe, CA, USA
Period10/23/0010/26/00

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'New SWEAT method for fast, accurate and stable electromigration testing on wafer level'. Together they form a unique fingerprint.

Cite this