Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures

Jordan Cook; Harrison Hones; Wei Xue; Lei Yu; Robert Krchnavek

doi:10.1109/NANO47656.2020.9183546

Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures

Jordan Cook
, Harrison Hones
, Wei Xue
, Lei Yu
, Robert Krchnavek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Polyimide/silicon dioxide nanocomposites were synthesized and tested dielectrically at both room and cryogenic temperatures. The dielectric strength of the nanocomposites showed significant increase from about 150 kV/mm at room temperature to roughly 300 kV/mm at the cryogenic temperature. This increase in dielectric strength is a result of the contraction of the host polymer around the embedded nanoparticles, which shortens the mean free path of electrons as well as the distance needed for electrons to accelerate to induce avalanche breakdown. The contraction of the host polymer also reduces the overlapping of the transition region, the outermost layer of the multi-core model, between individual nanoparticles. The findings from our experimental results and multi-core model can potentially advance the field of cryogenic dielectrics.

Original language	English (US)
Title of host publication	NANO 2020 - 20th IEEE International Conference on Nanotechnology, Proceedings
Publisher	IEEE Computer Society
Pages	35-38
Number of pages	4
ISBN (Electronic)	9781728182643
DOIs	https://doi.org/10.1109/NANO47656.2020.9183546
State	Published - Jul 2020
Event	20th IEEE International Conference on Nanotechnology, NANO 2020 - Virtual, Online, Canada Duration: Jul 29 2020 → Jul 31 2020

Publication series

Name	Proceedings of the IEEE Conference on Nanotechnology
Volume	2020-July
ISSN (Print)	1944-9399
ISSN (Electronic)	1944-9380

Conference

Conference	20th IEEE International Conference on Nanotechnology, NANO 2020
Country/Territory	Canada
City	Virtual, Online
Period	7/29/20 → 7/31/20

All Science Journal Classification (ASJC) codes

Bioengineering
Electrical and Electronic Engineering
Materials Chemistry
Condensed Matter Physics

Access to Document

10.1109/NANO47656.2020.9183546

Cite this

Cook, J., Hones, H., Xue, W., Yu, L., & Krchnavek, R. (2020). Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures. In NANO 2020 - 20th IEEE International Conference on Nanotechnology, Proceedings (pp. 35-38). Article 9183546 (Proceedings of the IEEE Conference on Nanotechnology; Vol. 2020-July). IEEE Computer Society. https://doi.org/10.1109/NANO47656.2020.9183546

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title = "Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures",

abstract = "Polyimide/silicon dioxide nanocomposites were synthesized and tested dielectrically at both room and cryogenic temperatures. The dielectric strength of the nanocomposites showed significant increase from about 150 kV/mm at room temperature to roughly 300 kV/mm at the cryogenic temperature. This increase in dielectric strength is a result of the contraction of the host polymer around the embedded nanoparticles, which shortens the mean free path of electrons as well as the distance needed for electrons to accelerate to induce avalanche breakdown. The contraction of the host polymer also reduces the overlapping of the transition region, the outermost layer of the multi-core model, between individual nanoparticles. The findings from our experimental results and multi-core model can potentially advance the field of cryogenic dielectrics.",

author = "Jordan Cook and Harrison Hones and Wei Xue and Lei Yu and Robert Krchnavek",

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year = "2020",

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doi = "10.1109/NANO47656.2020.9183546",

language = "English (US)",

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Cook, J, Hones, H, Xue, W , Yu, L & Krchnavek, R 2020, Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures. in NANO 2020 - 20th IEEE International Conference on Nanotechnology, Proceedings., 9183546, Proceedings of the IEEE Conference on Nanotechnology, vol. 2020-July, IEEE Computer Society, pp. 35-38, 20th IEEE International Conference on Nanotechnology, NANO 2020, Virtual, Online, Canada, 7/29/20. https://doi.org/10.1109/NANO47656.2020.9183546

Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures. / Cook, Jordan; Hones, Harrison; Xue, Wei et al.
NANO 2020 - 20th IEEE International Conference on Nanotechnology, Proceedings. IEEE Computer Society, 2020. p. 35-38 9183546 (Proceedings of the IEEE Conference on Nanotechnology; Vol. 2020-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures

AU - Cook, Jordan

AU - Hones, Harrison

AU - Xue, Wei

AU - Yu, Lei

AU - Krchnavek, Robert

PY - 2020/7

Y1 - 2020/7

N2 - Polyimide/silicon dioxide nanocomposites were synthesized and tested dielectrically at both room and cryogenic temperatures. The dielectric strength of the nanocomposites showed significant increase from about 150 kV/mm at room temperature to roughly 300 kV/mm at the cryogenic temperature. This increase in dielectric strength is a result of the contraction of the host polymer around the embedded nanoparticles, which shortens the mean free path of electrons as well as the distance needed for electrons to accelerate to induce avalanche breakdown. The contraction of the host polymer also reduces the overlapping of the transition region, the outermost layer of the multi-core model, between individual nanoparticles. The findings from our experimental results and multi-core model can potentially advance the field of cryogenic dielectrics.

AB - Polyimide/silicon dioxide nanocomposites were synthesized and tested dielectrically at both room and cryogenic temperatures. The dielectric strength of the nanocomposites showed significant increase from about 150 kV/mm at room temperature to roughly 300 kV/mm at the cryogenic temperature. This increase in dielectric strength is a result of the contraction of the host polymer around the embedded nanoparticles, which shortens the mean free path of electrons as well as the distance needed for electrons to accelerate to induce avalanche breakdown. The contraction of the host polymer also reduces the overlapping of the transition region, the outermost layer of the multi-core model, between individual nanoparticles. The findings from our experimental results and multi-core model can potentially advance the field of cryogenic dielectrics.

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M3 - Conference contribution

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T3 - Proceedings of the IEEE Conference on Nanotechnology

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BT - NANO 2020 - 20th IEEE International Conference on Nanotechnology, Proceedings

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ER -

Increased dielectric strength of polyimide/silicon dioxide nanocomposites at cryogenic temperatures

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