TY - GEN
T1 - Hermetically-Encapsulated Unidirectional Accelerometer Contact Microphone for Wearable Applications
AU - Gupta, Pranav
AU - Wen, Haoran
AU - Daruwalla, Anosh
AU - Moghimi, Mohammad J.
AU - Ayazi, Farrokh
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - We report on a novel wafer-level-packaged accelerometer contact microphone to pick up acoustic vibrations orthogonal to its contact surface without responding to airborne acoustic emissions. The design uses a high-bandwidth low-noise unidirectional capacitive accelerometer with a deformable frame suspending a proof-mass, designed to have larger displacement at the edge to allow for the implementation of shock stops. The sense electrodes use a nano-gap to provide high electrical sensitivity with high stiffness design and nano-gap damping electrodes enable near-critical damping in a low vacuum encapsulation to achieve a high bandwidth above 14 kHz. We demonstrate that the miniature accelerometer contact microphone placed on the throat can record human speech and heart sounds with high fidelity while rejecting surrounding noises.
AB - We report on a novel wafer-level-packaged accelerometer contact microphone to pick up acoustic vibrations orthogonal to its contact surface without responding to airborne acoustic emissions. The design uses a high-bandwidth low-noise unidirectional capacitive accelerometer with a deformable frame suspending a proof-mass, designed to have larger displacement at the edge to allow for the implementation of shock stops. The sense electrodes use a nano-gap to provide high electrical sensitivity with high stiffness design and nano-gap damping electrodes enable near-critical damping in a low vacuum encapsulation to achieve a high bandwidth above 14 kHz. We demonstrate that the miniature accelerometer contact microphone placed on the throat can record human speech and heart sounds with high fidelity while rejecting surrounding noises.
UR - https://www.scopus.com/pages/publications/85078701902
UR - https://www.scopus.com/pages/publications/85078701902#tab=citedBy
U2 - 10.1109/SENSORS43011.2019.8956590
DO - 10.1109/SENSORS43011.2019.8956590
M3 - Conference contribution
AN - SCOPUS:85078701902
T3 - Proceedings of IEEE Sensors
BT - 2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Sensors, SENSORS 2019
Y2 - 27 October 2019 through 30 October 2019
ER -