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Hermetically-Encapsulated Unidirectional Accelerometer Contact Microphone for Wearable Applications

  • Pranav Gupta
  • , Haoran Wen
  • , Anosh Daruwalla
  • , Mohammad J. Moghimi
  • , Farrokh Ayazi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report on a novel wafer-level-packaged accelerometer contact microphone to pick up acoustic vibrations orthogonal to its contact surface without responding to airborne acoustic emissions. The design uses a high-bandwidth low-noise unidirectional capacitive accelerometer with a deformable frame suspending a proof-mass, designed to have larger displacement at the edge to allow for the implementation of shock stops. The sense electrodes use a nano-gap to provide high electrical sensitivity with high stiffness design and nano-gap damping electrodes enable near-critical damping in a low vacuum encapsulation to achieve a high bandwidth above 14 kHz. We demonstrate that the miniature accelerometer contact microphone placed on the throat can record human speech and heart sounds with high fidelity while rejecting surrounding noises.

Original languageEnglish (US)
Title of host publication2019 IEEE Sensors, SENSORS 2019 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728116341
DOIs
StatePublished - Oct 2019
Externally publishedYes
Event18th IEEE Sensors, SENSORS 2019 - Montreal, Canada
Duration: Oct 27 2019Oct 30 2019

Publication series

NameProceedings of IEEE Sensors
Volume2019-October
ISSN (Print)1930-0395
ISSN (Electronic)2168-9229

Conference

Conference18th IEEE Sensors, SENSORS 2019
Country/TerritoryCanada
CityMontreal
Period10/27/1910/30/19

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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