TY - GEN
T1 - Experimental validation of the power blurring method
AU - Park, Je Hyoung
AU - Shin, Sangho
AU - Christofferson, James
AU - Shakouri, Ali
AU - Kang, Sung Mo
PY - 2010
Y1 - 2010
N2 - Accurate estimation of temperature profiles from the underlying power dissipation profiles has become an important tool for chip designers and reliability engineers due to increasing power dissipation in ICs and associated thermal effects. IC's surface temperature is conventionally calculated by finite element or finite difference solvers. These methods yield accurate results but the computation time could be several hours to obtain accurate dynamic temperature profiles with high spatial resolution. Previously, we have developed an ultra fast IC temperature profile calculation technique, named as Power Blurring (PB), which dramatically reduces the computation time by a factor of more than a thousand and keeps the error within 5% comparing to finite element analysis done by ANSYS [1]. In this paper, the power blurring method is validated against experimental measurements using a thermal test chip which was designed based on 5-stage ring oscillators. The simulation results and the measurement data show good agreements.
AB - Accurate estimation of temperature profiles from the underlying power dissipation profiles has become an important tool for chip designers and reliability engineers due to increasing power dissipation in ICs and associated thermal effects. IC's surface temperature is conventionally calculated by finite element or finite difference solvers. These methods yield accurate results but the computation time could be several hours to obtain accurate dynamic temperature profiles with high spatial resolution. Previously, we have developed an ultra fast IC temperature profile calculation technique, named as Power Blurring (PB), which dramatically reduces the computation time by a factor of more than a thousand and keeps the error within 5% comparing to finite element analysis done by ANSYS [1]. In this paper, the power blurring method is validated against experimental measurements using a thermal test chip which was designed based on 5-stage ring oscillators. The simulation results and the measurement data show good agreements.
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U2 - 10.1109/STHERM.2010.5444285
DO - 10.1109/STHERM.2010.5444285
M3 - Conference contribution
AN - SCOPUS:77952655211
SN - 9781424464586
T3 - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
SP - 240
EP - 244
BT - 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2010 - Proceedings 2010
T2 - 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2010
Y2 - 21 February 2010 through 25 February 2010
ER -