Experimental validation of the power blurring method

Je Hyoung Park, Sangho Shin, James Christofferson, Ali Shakouri, Sung Mo Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

Accurate estimation of temperature profiles from the underlying power dissipation profiles has become an important tool for chip designers and reliability engineers due to increasing power dissipation in ICs and associated thermal effects. IC's surface temperature is conventionally calculated by finite element or finite difference solvers. These methods yield accurate results but the computation time could be several hours to obtain accurate dynamic temperature profiles with high spatial resolution. Previously, we have developed an ultra fast IC temperature profile calculation technique, named as Power Blurring (PB), which dramatically reduces the computation time by a factor of more than a thousand and keeps the error within 5% comparing to finite element analysis done by ANSYS [1]. In this paper, the power blurring method is validated against experimental measurements using a thermal test chip which was designed based on 5-stage ring oscillators. The simulation results and the measurement data show good agreements.

Original languageEnglish (US)
Title of host publication26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2010 - Proceedings 2010
Pages240-244
Number of pages5
DOIs
StatePublished - May 28 2010
Event26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2010 - Santa Clara, CA, United States
Duration: Feb 21 2010Feb 25 2010

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Other

Other26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2010
CountryUnited States
CitySanta Clara, CA
Period2/21/102/25/10

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

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