Evaluation of electrical linewidth determination using Cross-Bridge and Multi-Bridge test structures

Linda Head, Harry A. Schafft

    Research output: Contribution to conferencePaperpeer-review

    3 Scopus citations

    Abstract

    The Multi-Bridge method is often used in the industry to measure electrical linewidths of interconnect lines because it requires less sensitive equipment than the standard Cross-Bridge method. The method assumes that the linewidth process bias is independent of design width, which is shown here to be only approximately correct. This can result in linewidth determinations that are significantly different from the values obtained by the Cross-Bridge method. This is observed most often at the narrower designed widths. A Composite method is described that minimizes these differences. The multi-bridge test structure can also be used to detect the linewidths at which chemical mechanical polishing (CMP) induces `dishing' effects in copper lines.

    Original languageEnglish (US)
    Pages41-45
    Number of pages5
    StatePublished - Dec 1 1999
    Event1999 IEEE International Integrated Reliability Workshop - Lake Tahoe, CA, USA
    Duration: Oct 18 1999Oct 21 1999

    Other

    Other1999 IEEE International Integrated Reliability Workshop
    CityLake Tahoe, CA, USA
    Period10/18/9910/21/99

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering

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