TY - GEN
T1 - Encapsulation of maleimide-based healing agent and reversible diels-alder chemistry for selfhealing and corrosion prevention
AU - Santos, Sadella C.
AU - Palmese, Giuseppe R.
N1 - Publisher Copyright:
Copyright 2016. Used by the Society of the Advancement of Material and Process Engineering with permission.
PY - 2016
Y1 - 2016
N2 - Protective epoxy coatings for metal substrates are used for wear resistance and physical protection against environmental conditions that may result in physical or chemical changes, such as corrosion. Previous work done by Pratama et al. [1] investigated the use of encapsulated solutions containing maleimide-based healing agents for self-healing of furan functionalized epoxy networks through reversible Diels-Alder chemistry. Results from these studies show that the use of phenyl acetate (PA) as a solvent, and the concentration and structure of maleimide healing agent affects the degree of physical and chemical bonding across the crack surface. In those studies a urea-formaldehyde (UF) encapsulation technique was used to create capsules with a diameter of ≤ 300 μm. Such capsules are too large for incorporation into protective coatings that generally have thickness of 30-40 μm. Thus capsules with an approximate diameter of ≤ 20 μm are desired. This was achieved by increasing shear rate and by incorporating ultrasonication processing to the UF encapsulation procedure. The purpose of this work is to study the effect of capsule size on the protective electrochemical properties in thin films representative of coatings.
AB - Protective epoxy coatings for metal substrates are used for wear resistance and physical protection against environmental conditions that may result in physical or chemical changes, such as corrosion. Previous work done by Pratama et al. [1] investigated the use of encapsulated solutions containing maleimide-based healing agents for self-healing of furan functionalized epoxy networks through reversible Diels-Alder chemistry. Results from these studies show that the use of phenyl acetate (PA) as a solvent, and the concentration and structure of maleimide healing agent affects the degree of physical and chemical bonding across the crack surface. In those studies a urea-formaldehyde (UF) encapsulation technique was used to create capsules with a diameter of ≤ 300 μm. Such capsules are too large for incorporation into protective coatings that generally have thickness of 30-40 μm. Thus capsules with an approximate diameter of ≤ 20 μm are desired. This was achieved by increasing shear rate and by incorporating ultrasonication processing to the UF encapsulation procedure. The purpose of this work is to study the effect of capsule size on the protective electrochemical properties in thin films representative of coatings.
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M3 - Conference contribution
AN - SCOPUS:84978117030
T3 - International SAMPE Technical Conference
BT - SAMPE Long Beach 2016 Conference and Exhibition
PB - Soc. for the Advancement of Material and Process Engineering
T2 - SAMPE Long Beach 2016 Conference and Exhibition
Y2 - 23 May 2016 through 26 May 2016
ER -