@inproceedings{7e35c88a9317492eaa8fd620feca0d14,
title = "Determination of shear stress at a solder paste/stencil interface",
abstract = "This paper will present the experimental set-up, a description of the relationship between this experiment and the actual stencil lift-off process, and shear stress data that has been acquired for a variety of solder pastes and plate separations.",
author = "Head, {Linda M.} and Vincent Rogers and Chitteranijan Sahay and James Constable",
year = "1994",
language = "English (US)",
isbn = "1558992227",
series = "Materials Research Society Symposium Proceedings",
publisher = "Publ by Materials Research Society",
pages = "425--433",
editor = "Peter Borgesen and Jensen, {Klavs F.} and Pollak, {Roger A.}",
booktitle = "Electronic Packaging Materials Science VII",
note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",
}