Determination of shear stress at a solder paste/stencil interface

Linda M. Head, Vincent Rogers, Chitteranijan Sahay, James Constable

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper will present the experimental set-up, a description of the relationship between this experiment and the actual stencil lift-off process, and shear stress data that has been acquired for a variety of solder pastes and plate separations.

Original languageEnglish (US)
Title of host publicationElectronic Packaging Materials Science VII
EditorsPeter Borgesen, Klavs F. Jensen, Roger A. Pollak
PublisherPubl by Materials Research Society
Pages425-433
Number of pages9
ISBN (Print)1558992227
StatePublished - Jan 1 1994
EventProceedings of the Fall 1993 MRS Meeting - Boston, MA, USA
Duration: Nov 29 1993Dec 3 1993

Publication series

NameMaterials Research Society Symposium Proceedings
Volume323
ISSN (Print)0272-9172

Other

OtherProceedings of the Fall 1993 MRS Meeting
CityBoston, MA, USA
Period11/29/9312/3/93

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Head, L. M., Rogers, V., Sahay, C., & Constable, J. (1994). Determination of shear stress at a solder paste/stencil interface. In P. Borgesen, K. F. Jensen, & R. A. Pollak (Eds.), Electronic Packaging Materials Science VII (pp. 425-433). (Materials Research Society Symposium Proceedings; Vol. 323). Publ by Materials Research Society.