TY - JOUR
T1 - BN Nanosheet/Polymer Films with Highly Anisotropic Thermal Conductivity for Thermal Management Applications
AU - Wu, Yuanpeng
AU - Xue, Ye
AU - Qin, Si
AU - Liu, Dan
AU - Wang, Xuebin
AU - Hu, Xiao
AU - Li, Jingliang
AU - Wang, Xungai
AU - Bando, Yoshio
AU - Golberg, Dmitri
AU - Chen, Ying
AU - Gogotsi, Yury
AU - Lei, Weiwei
N1 - Publisher Copyright:
© 2017 American Chemical Society.
PY - 2017/12/13
Y1 - 2017/12/13
N2 - The development of advanced thermal transport materials is a global challenge. Two-dimensional nanomaterials have been demonstrated as promising candidates for thermal management applications. Here, we report a boron nitride (BN) nanosheet/polymer composite film with excellent flexibility and toughness prepared by vacuum-assisted filtration. The mechanical performance of the composite film is highly flexible and robust. It is noteworthy that the film exhibits highly anisotropic properties, with superior in-plane thermal conductivity of around 200 W m-1 K-1 and extremely low through-plane thermal conductivity of 1.0 W m-1 K-1, making this material an excellent candidate for thermal management in electronics. Importantly, the composite film shows fire-resistant properties. The newly developed unconventional flexible, tough, and refractory BN films are also promising for heat dissipation in a variety of applications.
AB - The development of advanced thermal transport materials is a global challenge. Two-dimensional nanomaterials have been demonstrated as promising candidates for thermal management applications. Here, we report a boron nitride (BN) nanosheet/polymer composite film with excellent flexibility and toughness prepared by vacuum-assisted filtration. The mechanical performance of the composite film is highly flexible and robust. It is noteworthy that the film exhibits highly anisotropic properties, with superior in-plane thermal conductivity of around 200 W m-1 K-1 and extremely low through-plane thermal conductivity of 1.0 W m-1 K-1, making this material an excellent candidate for thermal management in electronics. Importantly, the composite film shows fire-resistant properties. The newly developed unconventional flexible, tough, and refractory BN films are also promising for heat dissipation in a variety of applications.
UR - http://www.scopus.com/inward/record.url?scp=85038210625&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85038210625&partnerID=8YFLogxK
U2 - 10.1021/acsami.7b15264
DO - 10.1021/acsami.7b15264
M3 - Article
C2 - 29160066
AN - SCOPUS:85038210625
SN - 1944-8244
VL - 9
SP - 43163
EP - 43170
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 49
ER -