Bimetallic Cu-Ni nanoparticles of varying composition (CuNi3, CuNi, Cu3Ni)

Jahangeer Ahmed; Kandalam V. Ramanujachary; Samuel E. Lofland; Anthony Furiato; Govind Gupta; S. M. Shivaprasad; Ashok K. Ganguli

doi:10.1016/j.colsurfa.2008.08.007

Bimetallic Cu-Ni nanoparticles of varying composition (CuNi₃, CuNi, Cu₃Ni)

Jahangeer Ahmed
, Kandalam V. Ramanujachary
, Samuel E. Lofland
, Anthony Furiato
, Govind Gupta
, S. M. Shivaprasad
, Ashok K. Ganguli

Research output: Contribution to journal › Article › peer-review

128 Scopus citations

Abstract

Cu-Ni (1:3, 1:1, 3:1) bimetallic nanoparticles have been synthesized by a microemulsion route using CTAB (cetyltrimethyl ammoniumbromide) as the surfactant and hydrazine/NaOH as the precipitating agent followed by reduction in hydrogen atmosphere. This is the first report of the synthesis of CuNi₃ and Cu₃Ni nanoparticles. Transmission electron microscopy (TEM) studies show nearly monodisperse and uniform nanoparticles of average grain size of 7 nm for the 1:1 alloy nanoparticles while the 1:3 and 3:1 compositions show uniform nanoparticles with the grain size in the range of 20-30 nm. X-ray photoelectron spectroscopy (XPS) studies confirm the expected Cu/Ni ratios in these alloys. These bimetallic nanoparticles show ferromagnetic behavior and the magnetization decreases with increase in concentration of copper. The specific surface area of these alloy nanoparticles was found to be in the range of 6-9.42 m²/g.

Original language	English (US)
Pages (from-to)	206-212
Number of pages	7
Journal	Colloids and Surfaces A: Physicochemical and Engineering Aspects
Volume	331
Issue number	3
DOIs	https://doi.org/10.1016/j.colsurfa.2008.08.007
State	Published - Dec 31 2008

All Science Journal Classification (ASJC) codes

Surfaces and Interfaces
Physical and Theoretical Chemistry
Colloid and Surface Chemistry

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10.1016/j.colsurfa.2008.08.007

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@article{816f826f398440778a08fa17a3987cce,

title = "Bimetallic Cu-Ni nanoparticles of varying composition (CuNi3, CuNi, Cu3Ni)",

abstract = "Cu-Ni (1:3, 1:1, 3:1) bimetallic nanoparticles have been synthesized by a microemulsion route using CTAB (cetyltrimethyl ammoniumbromide) as the surfactant and hydrazine/NaOH as the precipitating agent followed by reduction in hydrogen atmosphere. This is the first report of the synthesis of CuNi3 and Cu3Ni nanoparticles. Transmission electron microscopy (TEM) studies show nearly monodisperse and uniform nanoparticles of average grain size of 7 nm for the 1:1 alloy nanoparticles while the 1:3 and 3:1 compositions show uniform nanoparticles with the grain size in the range of 20-30 nm. X-ray photoelectron spectroscopy (XPS) studies confirm the expected Cu/Ni ratios in these alloys. These bimetallic nanoparticles show ferromagnetic behavior and the magnetization decreases with increase in concentration of copper. The specific surface area of these alloy nanoparticles was found to be in the range of 6-9.42 m2/g.",

author = "Jahangeer Ahmed and Ramanujachary, \{Kandalam V.\} and Lofland, \{Samuel E.\} and Anthony Furiato and Govind Gupta and Shivaprasad, \{S. M.\} and Ganguli, \{Ashok K.\}",

note = "Funding Information: The authors thank the Department of Science and Technology, CSIR, Govt. of India, and IIT Delhi for financial assistance. SEL acknowledges support from NSF DMR 0520471, and NSF DMR 0603644.",

year = "2008",

month = dec,

day = "31",

doi = "10.1016/j.colsurfa.2008.08.007",

language = "English (US)",

volume = "331",

pages = "206--212",

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T1 - Bimetallic Cu-Ni nanoparticles of varying composition (CuNi3, CuNi, Cu3Ni)

AU - Ahmed, Jahangeer

AU - Ramanujachary, Kandalam V.

AU - Lofland, Samuel E.

AU - Furiato, Anthony

AU - Gupta, Govind

AU - Shivaprasad, S. M.

AU - Ganguli, Ashok K.

N1 - Funding Information: The authors thank the Department of Science and Technology, CSIR, Govt. of India, and IIT Delhi for financial assistance. SEL acknowledges support from NSF DMR 0520471, and NSF DMR 0603644.

PY - 2008/12/31

Y1 - 2008/12/31

N2 - Cu-Ni (1:3, 1:1, 3:1) bimetallic nanoparticles have been synthesized by a microemulsion route using CTAB (cetyltrimethyl ammoniumbromide) as the surfactant and hydrazine/NaOH as the precipitating agent followed by reduction in hydrogen atmosphere. This is the first report of the synthesis of CuNi3 and Cu3Ni nanoparticles. Transmission electron microscopy (TEM) studies show nearly monodisperse and uniform nanoparticles of average grain size of 7 nm for the 1:1 alloy nanoparticles while the 1:3 and 3:1 compositions show uniform nanoparticles with the grain size in the range of 20-30 nm. X-ray photoelectron spectroscopy (XPS) studies confirm the expected Cu/Ni ratios in these alloys. These bimetallic nanoparticles show ferromagnetic behavior and the magnetization decreases with increase in concentration of copper. The specific surface area of these alloy nanoparticles was found to be in the range of 6-9.42 m2/g.

AB - Cu-Ni (1:3, 1:1, 3:1) bimetallic nanoparticles have been synthesized by a microemulsion route using CTAB (cetyltrimethyl ammoniumbromide) as the surfactant and hydrazine/NaOH as the precipitating agent followed by reduction in hydrogen atmosphere. This is the first report of the synthesis of CuNi3 and Cu3Ni nanoparticles. Transmission electron microscopy (TEM) studies show nearly monodisperse and uniform nanoparticles of average grain size of 7 nm for the 1:1 alloy nanoparticles while the 1:3 and 3:1 compositions show uniform nanoparticles with the grain size in the range of 20-30 nm. X-ray photoelectron spectroscopy (XPS) studies confirm the expected Cu/Ni ratios in these alloys. These bimetallic nanoparticles show ferromagnetic behavior and the magnetization decreases with increase in concentration of copper. The specific surface area of these alloy nanoparticles was found to be in the range of 6-9.42 m2/g.

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DO - 10.1016/j.colsurfa.2008.08.007

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JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects

JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects

IS - 3

ER -

Bimetallic Cu-Ni nanoparticles of varying composition (CuNi₃, CuNi, Cu₃Ni)

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