Alignment tolerant structures for ease of optoelectronic packaging

M. Dagenais; S. S. Saini; V. Vusirikala; R. E. Bartolo; R. D. Whaley; Z. Dilli; Y. Hu; Z. F. Fan; F. G. Johnson; H. Shen; J. Pamalupati; W. Zhou; D. R. Stone

Alignment tolerant structures for ease of optoelectronic packaging

M. Dagenais, S. S. Saini, V. Vusirikala, R. E. Bartolo, R. D. Whaley, Z. Dilli, Y. Hu, Z. F. Fan, F. G. Johnson, H. Shen, J. Pamalupati, W. Zhou, D. R. Stone

Computer Science

Research output: Contribution to journal › Conference article › peer-review

4 Scopus citations

Abstract

Expanded mode alignment tolerant optical structures will play an important role in low-cost, large-scale packaging of optoelectronic devices. In this paper, we present two expanded mode structures for operation at 1.55 μm. Our devices use single epitaxial growth and conventional fabrication schemes. High butt-coupling efficiencies (>40%) to a single mode fiber with relaxed alignment tolerances were achieved. The first of our devices uses adiabatic transformation over 500 μm. The second device uses resonant coupling over a much shorter region of 200 μm. The second scheme offers an interesting possibility for monolithic integration of active-passive components. We present the design and simulation results of such an integrated device.

Original language	English (US)
Pages (from-to)	128-137
Number of pages	10
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3626
State	Published - Jan 1 1999
Event	Proceedings of the 1999 Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV - San Jose, CA, USA Duration: Jan 28 1999 → Jan 28 1999

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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@article{27bbc5cc6e3c47b392d2eca9bd7cbc7c,

title = "Alignment tolerant structures for ease of optoelectronic packaging",

abstract = "Expanded mode alignment tolerant optical structures will play an important role in low-cost, large-scale packaging of optoelectronic devices. In this paper, we present two expanded mode structures for operation at 1.55 μm. Our devices use single epitaxial growth and conventional fabrication schemes. High butt-coupling efficiencies (>40%) to a single mode fiber with relaxed alignment tolerances were achieved. The first of our devices uses adiabatic transformation over 500 μm. The second device uses resonant coupling over a much shorter region of 200 μm. The second scheme offers an interesting possibility for monolithic integration of active-passive components. We present the design and simulation results of such an integrated device.",

author = "M. Dagenais and Saini, {S. S.} and V. Vusirikala and Bartolo, {R. E.} and Whaley, {R. D.} and Z. Dilli and Y. Hu and Fan, {Z. F.} and Johnson, {F. G.} and H. Shen and J. Pamalupati and W. Zhou and Stone, {D. R.}",

year = "1999",

month = jan,

day = "1",

language = "English (US)",

volume = "3626",

pages = "128--137",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Proceedings of the 1999 Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV ; Conference date: 28-01-1999 Through 28-01-1999",

}

Alignment tolerant structures for ease of optoelectronic packaging. / Dagenais, M.; Saini, S. S.; Vusirikala, V.; Bartolo, R. E.; Whaley, R. D.; Dilli, Z.; Hu, Y.; Fan, Z. F.; Johnson, F. G.; Shen, H.; Pamalupati, J.; Zhou, W.; Stone, D. R.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 3626, 01.01.1999, p. 128-137.

Research output: Contribution to journal › Conference article › peer-review

TY - JOUR

T1 - Alignment tolerant structures for ease of optoelectronic packaging

AU - Dagenais, M.

AU - Saini, S. S.

AU - Vusirikala, V.

AU - Bartolo, R. E.

AU - Whaley, R. D.

AU - Dilli, Z.

AU - Hu, Y.

AU - Fan, Z. F.

AU - Johnson, F. G.

AU - Shen, H.

AU - Pamalupati, J.

AU - Zhou, W.

AU - Stone, D. R.

PY - 1999/1/1

Y1 - 1999/1/1

N2 - Expanded mode alignment tolerant optical structures will play an important role in low-cost, large-scale packaging of optoelectronic devices. In this paper, we present two expanded mode structures for operation at 1.55 μm. Our devices use single epitaxial growth and conventional fabrication schemes. High butt-coupling efficiencies (>40%) to a single mode fiber with relaxed alignment tolerances were achieved. The first of our devices uses adiabatic transformation over 500 μm. The second device uses resonant coupling over a much shorter region of 200 μm. The second scheme offers an interesting possibility for monolithic integration of active-passive components. We present the design and simulation results of such an integrated device.

AB - Expanded mode alignment tolerant optical structures will play an important role in low-cost, large-scale packaging of optoelectronic devices. In this paper, we present two expanded mode structures for operation at 1.55 μm. Our devices use single epitaxial growth and conventional fabrication schemes. High butt-coupling efficiencies (>40%) to a single mode fiber with relaxed alignment tolerances were achieved. The first of our devices uses adiabatic transformation over 500 μm. The second device uses resonant coupling over a much shorter region of 200 μm. The second scheme offers an interesting possibility for monolithic integration of active-passive components. We present the design and simulation results of such an integrated device.

UR - http://www.scopus.com/inward/record.url?scp=0032656649&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032656649&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0032656649

VL - 3626

SP - 128

EP - 137

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

T2 - Proceedings of the 1999 Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV

Y2 - 28 January 1999 through 28 January 1999

ER -