Alignment tolerant structures for ease of optoelectronic packaging

M. Dagenais, S. S. Saini, V. Vusirikala, R. E. Bartolo, R. D. Whaley, Z. Dilli, Y. Hu, Z. F. Fan, F. G. Johnson, H. Shen, J. Pamalupati, W. Zhou, D. R. Stone

Research output: Contribution to journalConference article

4 Scopus citations

Abstract

Expanded mode alignment tolerant optical structures will play an important role in low-cost, large-scale packaging of optoelectronic devices. In this paper, we present two expanded mode structures for operation at 1.55 μm. Our devices use single epitaxial growth and conventional fabrication schemes. High butt-coupling efficiencies (>40%) to a single mode fiber with relaxed alignment tolerances were achieved. The first of our devices uses adiabatic transformation over 500 μm. The second device uses resonant coupling over a much shorter region of 200 μm. The second scheme offers an interesting possibility for monolithic integration of active-passive components. We present the design and simulation results of such an integrated device.

Original languageEnglish (US)
Pages (from-to)128-137
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3626
StatePublished - Jan 1 1999
EventProceedings of the 1999 Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV - San Jose, CA, USA
Duration: Jan 28 1999Jan 28 1999

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Dagenais, M., Saini, S. S., Vusirikala, V., Bartolo, R. E., Whaley, R. D., Dilli, Z., Hu, Y., Fan, Z. F., Johnson, F. G., Shen, H., Pamalupati, J., Zhou, W., & Stone, D. R. (1999). Alignment tolerant structures for ease of optoelectronic packaging. Proceedings of SPIE - The International Society for Optical Engineering, 3626, 128-137.